AI Servers & Data Centers
Thermal interfaces for server CPUs and non-Die infrastructure components.
Use Maxtor materials where the interface, assembly conditions and product evidence align. Start with CPU, NVSwitch, NIC/DPU, VRM, memory and data center maintenance conditions.
Conceptual application view
CPU-to-heatsink interface
Map the processor-to-heatsink interface before material selection: flatness, target bond line, mounting pressure, temperature range and service interval.
Conceptual application view
Network and data-processing cards
Review component height variation, pad compression, mechanical retention and rework access across network and data-processing cards.
Conceptual application view
Power delivery and memory interfaces
Document electrical isolation needs, component geometry, pad thickness and assembly pressure around power delivery and memory.
Share the interface conditions.
Include geometry, gap, contact pressure, temperature, service conditions and estimated quantity.