CPU / heatsink
Review flatness, bond line, pressure, temperature and service expectations.
Primary pathAI Servers & Data Centers
Thermal interfaces for server CPUs and non-Die infrastructure components.
Use Maxtor materials where the interface, assembly conditions and product evidence align. Start with CPU, NVSwitch, NIC/DPU, VRM, memory and data center maintenance conditions.
NVSwitch / NIC / DPU
Review component height variation, compression and rework access.
Engineering reviewVRM / memory
Review electrical constraints, geometry and assembly pressure.
Engineering reviewShare the interface conditions.
Include geometry, gap, contact pressure, temperature, service conditions and estimated quantity.