Thermal interface materials

High-conductivity materials for critical electronics interfaces.

Thermal grease, pads and phase-change materials for PCs, AI infrastructure, power electronics and industrial systems.

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CPU / GPU contacts | component gaps | thin phase-change interfaces

Maxtor CTG8 thermal grease beside a processor thermal interface and copper cooling plate

Customer feedback

Rated by real builders and technicians.

Verified reviews from customers across 15+ countries.

★ 4.8/5

Based on 70+ verified customer reviews

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★★★★★

"GREAT PRODUCT! BETTER THAN HONEYWELL!! Fast shipping and awesome packaging, includes sticky tape and tweezers. Super easy application."

Rory M. Chile
XTP-001 Phase Change
★★★★★

"Was a small little tube, but there was more than expected in it. Used it to fix my PS3, and it works now like a charm!"

Maurice B. Canada
CTG8 Thermal Grease
★★★★★

"Excellent, thick and effective. Exactly what I needed for my gaming PC build."

Maggie P. United States
CTG10 Thermal Paste
★★★★★

"The product arrived within two weeks, whole and intact, so I can recommend the product and the seller."

Porter S. Ukraine
CTG8 Thermal Grease
★★★★★

"Fine working perfectly recommended tested, quickly sent recommendations of good and standard."

Marina M. Brazil
CTG8 Thermal Grease

AI server interface map

See where thermal interface materials work.

Conceptual AI server showing processor, memory, power and accelerator thermal interface locations

Processor / cold plate

The thermal interface sits between the processor package and the cooling assembly.

  1. 1 Thermal grease / PCM Processor contact surface Fills microscopic surface gaps between the processor package and cooler.
  2. 2 Thermal pads Memory banks Gap-filling materials support contact with the memory cooling structure.
  3. 3 Pads / interface materials Accelerator and networking modules Interface materials connect component heat spreaders to module cooling plates.
Conceptual networking accelerator card and heatsink installed in an AI server

DPU / NIC

High-speed networking and data-processing cards use compact component-to-heatsink interfaces.

  1. 1 Thermal pads / grease Module heatsink interface The interface material transfers heat from processors and supporting components into the card heatsink.
Conceptual server memory bank and VRM heatsink assembly

VRM / memory

Power-delivery and memory components use gap-filling contact beneath shared heatsinks.

  1. 1 Thermal pads Memory component gaps Pads bridge designed gaps between memory components and their cooling structure.
  2. 2 Thermal pads VRM heatsink contact Compliant pads maintain contact across power components with different heights.

Applications

Thermal interfaces across personal and professional electronics.

Conceptual DIY PC service scene showing CPU, GPU, VRAM and VRM thermal interfaces

DIY Gaming PCs

CPU and GPU contact surfaces use thermal grease, while VRAM and VRM gaps use correctly sized thermal pads.

  1. 1 Thermal grease CPU / cooler cold plate A thin thermal compound layer fills surface micro-gaps at the CPU cooler interface.
  2. 2 Thermal grease / PCM GPU / heatsink contact The GPU contact surface transfers heat into the graphics cooler cold plate.
  3. 3 Thermal pads VRAM and VRM gaps Pads bridge designed component gaps without covering unrelated PCB areas.
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Conceptual home game console showing the processor, heatsink and component gap interfaces

Home Game Consoles

Processor contact and model-specific component gaps require different material forms during careful maintenance.

  1. 1 Thermal grease / PCM APU contact surface Thermal compound supports direct contact between the processor package and cooling plate.
  2. 2 Contact surface Heatsink contact plate The matching metal surface collects heat before it enters the heat pipe and fin stack.
  3. 3 Thermal pads Memory and power gaps Pads bridge designed gaps between supporting components and the cooling structure.
Explore console cooling
Conceptual power electronics assembly showing module, cold plate and control board interfaces

New Energy

Power modules, BMS assemblies and charging electronics connect heat sources to cold plates and enclosures.

  1. 1 Thermal grease / pad Power module base The module base transfers concentrated heat into the cooling structure.
  2. 2 Interface layer Cold plate path The metal cooling path carries heat away from the power electronics assembly.
  3. 3 Thermal pads Control electronics Supporting boards may use pads where the enclosure design provides a defined gap.
Explore New Energy
Conceptual industrial control cabinet and fanless computer with a component-to-enclosure thermal interface

Industrial Electronics

Fanless computers, controls and communications hardware use enclosure and heatsink interfaces for continuous heat removal.

  1. 1 Thermal pad Component-to-enclosure gap A compliant pad connects the board heat source to the finned metal enclosure.
  2. 2 Cooling structure Finned enclosure The enclosure becomes part of the passive heat-removal path.
  3. 3 Interface materials Control and power hardware Thermal interfaces support compact industrial electronics where the assembly provides a defined contact path.
Explore Industrial
Conceptual robot controller showing compute module, thermal pad and heatsink stack

Robotics

Control systems and edge-compute modules need compact thermal paths inside constrained assemblies.

  1. 1 Heat source Compute module The processor and supporting components generate heat inside the controller.
  2. 2 Thermal pad Gap-filling layer A pad bridges the designed distance between the compute module and metal plate.
  3. 3 Cooling structure Heat spreader The upper metal structure distributes heat into the controller cooling path.
Explore Robotics
Conceptual UAV showing flight controller, companion computer and power electronics interfaces

UAV Systems

Flight controllers, companion computers and power electronics use compact component-to-spreader interfaces.

  1. 1 Thermal pad / grease Companion computer The compute module uses a controlled contact path to move heat into a spreader or enclosure.
  2. 2 Thermal pad Interface stack Exploded layers show the component, interface material and metal cooling plate relationship.
  3. 3 Thermal pads Power electronics Supporting power components may use pads where the mechanical design provides a defined gap.
Explore UAV Systems

Material solutions

Match the material to the thermal interface.

Performance data

Technical performance at a glance.

Engineered for stable thermal contact.

Thermal Grease

CTG12

Typical interfaces CPU / GPU cooler contact

18.0 W/mK

Operating range
-40 to 150 °C
Material property
Non-conductive
View technical data

Thermal Pad

AP-14

Typical interfaces VRAM / VRM / memory and power gaps

16.8 W/mK

Operating range
-50 to 250 °C
Thickness
0.5–1.5 mm available in this listing
Material form
Compliant thermal pad
View technical data

Phase Change Material

XTP-001

Typical interfaces Thin CPU / GPU processor interfaces

22.5 W/mK

Operating range
-40 to 125 °C
Thickness
0.25 mm
Material form
Phase-change material
View technical data

Thermal Grease

MTP-8301C

Typical interfaces SiC modules / BMS / charging equipment

12.0 W/mK

Operating range
-50 to 250 °C
Material property
Low oil separation
View technical data

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PC builders & gamers

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System integration

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Distribution

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Exhibitions and team

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Maxtor team

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Industry connections

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Technical help

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TDS

Technical Data Sheets

Model-specific conductivity, temperature and material properties.

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MSDS

Safety documentation

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Application

How to Apply

Prepare surfaces, confirm the target bond line and follow product-specific guidance.

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