Thermal interface materials

High-conductivity materials for critical electronics interfaces.

Thermal grease, pads and phase-change materials for PCs, AI infrastructure, power electronics and industrial systems.

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CPU / GPU contacts | component gaps | thin phase-change interfaces

AI server interface map

See where thermal interface materials work.

The thermal interface sits between the processor package and the cooling assembly.

1 Thermal grease / PCM Processor contact surface Fills microscopic surface gaps between the processor package and cooler.
2 Thermal pads Memory banks Gap-filling materials support contact with the memory cooling structure.
3 Pads / interface materials Accelerator and networking modules Interface materials connect component heat spreaders to module cooling plates.

High-speed networking and data-processing cards use compact component-to-heatsink interfaces.

1 Thermal pads / grease Module heatsink interface The interface material transfers heat from processors and supporting components into the card heatsink.

Power-delivery and memory components use gap-filling contact beneath shared heatsinks.

1 Thermal pads Memory component gaps Pads bridge designed gaps between memory components and their cooling structure.
2 Thermal pads VRM heatsink contact Compliant pads maintain contact across power components with different heights.

Applications

CPU and GPU contact surfaces use thermal grease, while VRAM and VRM gaps use correctly sized thermal pads.

1 Thermal grease CPU / cooler cold plate A thin thermal compound layer fills surface micro-gaps at the CPU cooler interface.
2 Thermal grease / PCM GPU / heatsink contact The GPU contact surface transfers heat into the graphics cooler cold plate.
3 Thermal pads VRAM and VRM gaps Pads bridge designed component gaps without covering unrelated PCB areas.

Shop PC thermal materials

Processor contact and model-specific component gaps require different material forms during careful maintenance.

1 Thermal grease / PCM APU contact surface Thermal compound supports direct contact between the processor package and cooling plate.
2 Contact surface Heatsink contact plate The matching metal surface collects heat before it enters the heat pipe and fin stack.
3 Thermal pads Memory and power gaps Pads bridge designed gaps between supporting components and the cooling structure.

Explore console cooling

Power modules, BMS assemblies and charging electronics connect heat sources to cold plates and enclosures.

1 Thermal grease / pad Power module base The module base transfers concentrated heat into the cooling structure.
2 Interface layer Cold plate path The metal cooling path carries heat away from the power electronics assembly.
3 Thermal pads Control electronics Supporting boards may use pads where the enclosure design provides a defined gap.

Explore New Energy

Fanless computers, controls and communications hardware use enclosure and heatsink interfaces for continuous heat removal.

1 Thermal pad Component-to-enclosure gap A compliant pad connects the board heat source to the finned metal enclosure.
2 Cooling structure Finned enclosure The enclosure becomes part of the passive heat-removal path.
3 Interface materials Control and power hardware Thermal interfaces support compact industrial electronics where the assembly provides a defined contact path.

Explore Industrial

Control systems and edge-compute modules need compact thermal paths inside constrained assemblies.

1 Heat source Compute module The processor and supporting components generate heat inside the controller.
2 Thermal pad Gap-filling layer A pad bridges the designed distance between the compute module and metal plate.
3 Cooling structure Heat spreader The upper metal structure distributes heat into the controller cooling path.

Explore Robotics

Flight controllers, companion computers and power electronics use compact component-to-spreader interfaces.

1 Thermal pad / grease Companion computer The compute module uses a controlled contact path to move heat into a spreader or enclosure.
2 Thermal pad Interface stack Exploded layers show the component, interface material and metal cooling plate relationship.
3 Thermal pads Power electronics Supporting power components may use pads where the mechanical design provides a defined gap.